Present and Future Applications for Laser Processing of Hybrids and Semiconductors

Abstract

Present and future development of laser processing as a production technique for modifying semiconductor devices, improving yields, and decreasing development times are described. Current applications covered include thick‐ and thin‐film resistor trimming, deposited film and polysilicon resistors on silicon trimming and redundant memory repair. Emerging applications include microcircuit mask making and capacitor trimming. Examples of processes still under development include selective annealing, minority‐carrier lifetime doping, and device diagnostics by laser imaging.

Citation

Swenson, E.J. (1985), "Present and Future Applications for Laser Processing of Hybrids and Semiconductors", Microelectronics International, Vol. 2 No. 3, pp. 43-46. https://doi.org/10.1108/eb044186