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New products

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 February 1988

28

Abstract

Augat/Isotronics now offer injection moulded, glass‐to‐metal sealed hybrid circuit packages providing many advantages over conventional machined components.

Citation

(1988), "New products", Microelectronics International, Vol. 5 No. 2, pp. 92-95. https://doi.org/10.1108/eb044330

Publisher

:

MCB UP Ltd

Copyright © 1988, MCB UP Limited

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