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Integrated Magnetics Components Using Thick Film Hybrid Technology

N. Aitmani (ESEL‐ENSERB, Université de Bordeaux, France)
Y. Ousten (ESEL‐ENSERB, Université de Bordeaux, France)
J.L. Aucouturier (ESEL‐ENSERB, Université de Bordeaux, France)
D. Michaux (ESEL‐ENSERB, Université de Bordeaux, France Merlin Gérin, Grenoble, France)
P. Mas (ESEL‐ENSERB, Université de Bordeaux, France Merlin Gérin, Grenoble, France)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 January 1989

36

Abstract

Recent advances in solid state power conversion, specially in the high frequency domain, have shown the need for magnetics components for hybrid circuits. This paper describes the design and realisation of thick film inductors and transformers using a ferromagnetic ink. A square inductor has been modelled and its magnetic behaviour simulated by using the ANSYS program.

Citation

Aitmani, N., Ousten, Y., Aucouturier, J.L., Michaux, D. and Mas, P. (1989), "Integrated Magnetics Components Using Thick Film Hybrid Technology", Microelectronics International, Vol. 6 No. 1, pp. 18-21. https://doi.org/10.1108/eb044352

Publisher

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MCB UP Ltd

Copyright © 1989, MCB UP Limited

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