Citation
Rigelsford, J. (2002), "Method for transferring wafers", Industrial Robot, Vol. 29 No. 4. https://doi.org/10.1108/ir.2002.04929dad.005
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
Method for transferring wafers
Method for transferring wafers
Applicant: Mosel Vitelic Inc., TaiwanPatent number: US6,336,787Publication date: 8 January 2002Title: Method for transferring wafers in a semiconductor tape-peeling apparatus
This invention relates to a method for transferring wafers in a semiconductor tape-peeling apparatus, and more particularly, to a wafer transfer method which prevents a wafer from being broken during a wafer transfer process.
The semiconductor tape-peeling apparatus described comprises a first cassette for storing a plurality of wafers and a robot arm. Each of the wafers has a front-side to which a tape is adhered and a back-side. The robot arm includes a means for sucking and transferring the wafers. The wafer transfer method comprises the steps of sucking the front side of the uppermost one of the wafers stored in the first cassette and then unloading the wafer. This technique ensures that warped wafers stored in the cassette are not damaged by the robot arm.