Patent abstracts

Citation

(2009), "Patent abstracts", Industrial Robot, Vol. 36 No. 1. https://doi.org/10.1108/ir.2009.04936aad.002

Patent abstracts

Article Type: Patent abstracts From: Industrial Robot: An International Journal, Volume 36, Issue 1

Title: Full Automatic 16-Axis Grinding-polishing Device

Patent number: JP2008036776

Publication date: 21 August 2008

Applicant: Lapmaster Sft Corp

Abstract: Problem to be solved: to achieve extreme thinning, diameter expanding, uniformized quality, ultra high precision flat machining, mirror finishing, and mass producing, of a semiconductor wafer.

Solution: The polishing device is equipped with: a casing; a delivery side positioning table; a first grinding-polishing table; a second grinding-polishing table; a storage side separation table; a delivery side robot; a delivery cassette; a storage side robot; a storage side cassette; an indexing table; a column; and a spindle shaft. The delivery side positioning table is disposed for loading four pieces semiconductor wafer W. The indexing table is disposed in the central position of first grinding-polishing table, the second grinding-polishing table, and the storage side separation table. The indexing table is made to be normally turned, reversely turned and stopped at 90, 180, 270, and 360°, and an oscillation means an interposition is made between the indexing table and the column.

Title: Polishing Device

Patent number: JP2007189258

Publication date: 26 July 2007

Applicant: Ebara Corp; Toshiba Corp

Abstract: Problem to be solved: to provide a polishing device adapted for blocking of the device, having excellent productivity, extendibility, maintainability, and adaptability to users, and having good cooperation efficiency with incidental facility.

Solution: The device is equipped with: a load/unload block for delivering a cassette; conveyance block for moving a wafer, polishing block for polishing the wafer; cleaning block for cleaning the wafer after polishing; and control block which memorizes relative position of the cassette of the load/unload block and robot of the conveyance block by teaching, further memorizes the number of wafers in the cassette and position information of the cassette on a housing shelf by the measurement of a sensing sensor, and instructs a robot to take the semiconductor wafer out of the shelf of the cassette and to return polished, cleaned, and dried semiconductor wafer to the housing shelf.

Title: Finishing Device and Finishing Method

Patent number: JP2007203407

Publication date: 16 August 2007

Applicant: Aisin Seiki

Abstract: Problem to be solved: to remove a section welded by butting a plurality of members to prepare a smooth finish surface automatically.

Solution: This finishing device has: a robot having a working tool for removing a predetermined part of a workpiece and finishing it; a measuring means for measuring a 3D shape including the predetermined part to be removed of the workpiece to obtain shape data before working; a free curved surface preparing means for obtaining free curved surface data of the predetermined part from remaining shape data left after removing the shape data to be removed of the predetermined part to be removed from the shape data before working; a removed data preparing means for preparing the removed shape data and data to be removed from the free curved surface data; and a robot control means for removing the predetermined part of the workpiece by driving the robot, based on the removed data.

Title: Flattening Device of Semiconductor Substrate and Flattening Method

Patent number: JP2007260850

Publication date: 11 October 2007

Applicant: Okamoto Machine Tool Works

Abstract: Problem to be solved: to provide a substrate flattening device compact in foot print, which is thins and flattens a substrate by grinding, polishing and working a back surface of the semiconductor substrate in high throughput.

Solution: The substrate flattening device is provided with: a grinding work stage furnished with a substrate storage stage indoor and arranging substrate holders of a member constituting an articulated type carrier robot, a temporary placing base for positioning, a moving carrier pad and three stages of a substrate loading/unloading stage rough grinding stage and, a finishing grinding stage, on a concentric circle on a first index type rotating table on a base indoor; and a polishing work stage arranging a substrate holder table constituting a substrate loading/unloading finishing polishing stage and a substrate holder table constituting a rough polishing stage on a concentric circle on a second index type rotating table.

Title: Polishing Apparatus and Method with Direct Load Platen Background

Patent number: WO2007041020

Publication date: 12 April 2007

Applicant: Applied Materials Inc. (USA); Chen Hung Chih (USA)

Abstract: A method and apparatus for chemical mechanical polishing includes a platen supports a polishing article, a robot located proximate the platen, a carrier head having a retaining ring, and a carrier heads support mechanism. The robot is configured to position a substrate on the polishing article, and the carrier heads support mechanism is configured to move the carrier head into a position that the retaining ring surrounds the substrate.

Title: Robot System and Method for Maintenance of Base Plates in Electrometallurgical and Industrial Processes

Patent number: US2007147961

Publication date: 28 June 2007

Inventor: Salamanca Hugo (CL)

Abstract: At present, the maintenance of base plates in electrometallurgical processes is carried out manually which increases the maintenance costs and decreases the quality and the useful life of the base plates. Owing to the above, a robot system and method have been developed for the polishing and replacement of base plates insulation in an automated way. The robotic system is composed mainly of a robotic manipulator of at least 5 degrees of freedom, and a gripping mechanism which allows to take the polishing device, also the system has a second robotic manipulator that a gripping mechanism replaces the base plates insulations.

Title: Machine for Manufacture of Grinding Pots and Segments with Robot on Circular Table

Patent number: SI22120

Publication date: 30 April 2007

Applicant: Comet Umetni Brusi In Nekovine (SI)

Abstract: The subject of invention is a machine for the manufacture of grinding pots and segments with a robot on a circular table. The technical problem the invention is solving is such a structure of the machine that it enables a simultaneous execution of various phases in the process of the machine manufacture of grinding pots and segments. Products made on the machine according to the invention are identical among themselves and repeatable regarding their required properties at any time. The technological process assures the traceability of the manufacture in all parameters.