Keywords
Citation
(1999), "Direct die feeder reduces packaging costs", Microelectronics International, Vol. 16 No. 2. https://doi.org/10.1108/mi.1999.21816bad.012
Publisher
:Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
Direct die feeder reduces packaging costs
Direct die feeder reduces packaging costs
Keywords Feeders, Zevatech
Zevatech® Inc. has announced the addition of the SMT Vision award-winning Hover-Davis direct die feeder to its 700 Series accessories (Plate 1). The feeder meets the challenges presented by wafer component packaging. This addition to the 700 Series allows bare die and flip chip to be picked directly from four- or eight-inch wafers and presented to the 700 Series pick-and-place machines in only three inches of feeder space.
Since the die or flip chip are delivered direct from the wafer to the machine and taping is eliminated, the manufacturer saves the $0.10 to $0.20 per part associated with moving the chip from wafer to tape or tray. Also, the possibility of damage in handling is significantly lower since the components stay on the wafer until the last possible moment.
Plate 1Zevatech direct die feeder
The direct die feeder presents only known non-inked die to the machine. This feature saves manufacturers the time and money associated with rework.
For more information about the direct die feeder, contact Zevatech at +1 919-460-011 l; by fax at +1 919469-0480; by mail at 507 Airport Boulevard, Morrisville, NC 27560; or on the World Wide Web at www.zevatech.com.