Keywords
Citation
(2001), "Amkor adds latest packaging equipment to advanced prototype development lab", Microelectronics International, Vol. 18 No. 1. https://doi.org/10.1108/mi.2001.21818aab.016
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
Amkor adds latest packaging equipment to advanced prototype development lab
Amkor adds latest packaging equipment to advanced prototype development lab
Keyword: Amkor
To meet increased customer focus on advanced flip chip and system-in-package production, Amkor Technology has added the latest equipment from several manufacturers to its expanding prototype package development lab here.
The lab, which opened last year to assist US-based semiconductor companies with local development of advanced packages, has been expanded to include the newest systems for ball attach, wire bond and die attach processes.
"The lab was developed to ensure that our customers move from concept to production in the shortest possible time", said Jonathon Greenwood, senior director of Arnkor's Advanced Package Development Center. In combination with our adjacent design center, the lab specializes in reducing the time between concept and delivery for advanced flip chip and system-in-package ICs, which is a major advantage for customers.
In addition to advanced and traditional packaging equipment, the expanded laboratory operates one of the first laser solder ball attachment systems in service. The system, a Kulicke and Soffa 9388 Laser Pro, uses a laser for solder reflow at rates up to 30 balls per second and accuracy of 5 microns. Also added are two high-speed, fine-pitch K&S 8028 wire bond systems with bonding speeds in excess of ten wires per second at 60 micron in-line bond pad pitch. A third system, a Datacon APM flip chip die attach system, is capable of 10 micron placement repeatability at 3 sigma.
"Our goal is to provide customers with high quality prototypes in a very short cycle time once the design and materials are received", said Steve Shermer, operations director for the center. "By locating the lab in Arizona, we can sharply reduce development time on these new technologies. We offer some of the most advanced prototype packaging capabilities in the USA."
To further speed the time to production, all package data, including production processes, reliability reports, drawings, equipment process programs and other manufacturing information, can be transmitted electronically from the lab in Arizona to Amkor production facilities in Korea and the Philippines.