LCD assembly gains through-put increase with Micro Join 4200 Series Bonders

Citation

(2001), "LCD assembly gains through-put increase with Micro Join 4200 Series Bonders", Microelectronics International, Vol. 18 No. 1. https://doi.org/10.1108/mi.2001.21818aad.001

LCD assembly gains through-put increase with Micro Join 4200 Series Bonders

LCD assembly gains through-put increase with Micro Join 4200 Series Bonders

Keywords: Microjoin, Bonding

Micro Join, Inc., (formerly Hughes and Palomar Technologies) has announced the high production through-put capabilities of their new series of dual-head Hot Bar bonders for LCD module assembly. The model 4200 Series (Plate 1), which claim to provide superior control necessary for joining TAB, flex or Heat Seal connectors to PCB using ACF or Solder Reflow, can double LCD assembly production through-put. The 4200 Series provide dual bonding/loading stages, rotary or shuttle base, and precision process control software. Micro Join's 4200 Hot Bar bonders offer flexible configurations and robust control capabilities to significantly increase LCD assembly yields while reducing manufacturing costs.

Plate 1 4200 system from Micro Join

The new model 4200 Hot Bar bonders have dual heads each with their own power control circuit. The dual head configurations are available with rotary tables or dual shuttle systems and employ parallel processing for a 2x-production through-put increase over traditional single head units.

The rotary table designs may be equipped with four fixed or adjustable material fixtures. Operators load LCD assemblies and PCBs in the two front fixtures. Dual cameras may be added to assist operator registration of connector leads to substrate pads. At operator command, both fixtures rotate 1808 to the rear bonding positions and two more fixtures are ready for loading. While the Hot Bar bonding sequence runs, the operator places two more LCD assemblies and substrate in the new fixtures. When the first two assemblies are complete, the rotary table moves 1808 and allows the operator to off-load two completed assemblies and start the process again.

The new model 4200 Hot Bar bonders may also be used for applications with multiple bond sites. Two independently controlled pneumatic or manual shuttles may be fitted with either fixed or adjustable material fixtures. The first shuttle is used to process the first bond. When completed, the operator removes the bonded assembly from the first fixture and places it in the second fixture. While the second Hot Bar bonding sequence runs, the operator loads the first fixture and starts that bonding sequence. First and second bonds are conducted in parallel providing a 2x-production advantage.

Further details: Kathleen Prestera. Tel: +1 858 877 2100; Fax: +1 858 877 2120; E-mail: communications@microjoin.com