MCE launches low risk, low customised chips for measurement and sensing

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2001

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Keywords

Citation

(2001), "MCE launches low risk, low customised chips for measurement and sensing", Microelectronics International, Vol. 18 No. 1. https://doi.org/10.1108/mi.2001.21818aad.007

Publisher

:

Emerald Group Publishing Limited

Copyright © 2001, MCB UP Limited


MCE launches low risk, low customised chips for measurement and sensing

MCE launches low risk, low customised chips for measurement and sensing

Keywords: MCE, Sensors, Measurement

Micro Circuit Engineering (MCE Tewkesbury) has launched a new family of mixed signal application-specific integrated circuits (ASICs) for sensing and instrumentation applications (Plate 4).

Plate 4 MCE's wire bonded mixed signal ASIC in ceramic package

These devices can integrate the analogue (linear) signal with the digital control circuitry on one piece of silicon. This can simplify the sensor design, enhance the electrical performance of the sensor and reduce overall system costs.

One of the major hurdles to exploitation of this technology is the high non-recurring engineering costs associated with the development of mixed signal devices. The MCE family of mixed signal ASICs offers a highly reliable system with low entry and piece part costs, a quick turnaround and no restrictions on volume.

One of the key features is the patented "zip" structure, which facilitates electrical testing of the analogue and digital circuitry. A modular structure with fully characterised cells has been created to enable design engineers to customise and optimise the circuit to a specific application.

Further details: MCE Tewkesbury; Tel: +44 (0) 1684 297 777; Fax: +44 (0) 1684 299 435; E-mail: sales@sia-mce.co.uk

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