Keywords
Citation
(2002), "Scribe and break 100-3 for delicate wafers", Microelectronics International, Vol. 19 No. 2. https://doi.org/10.1108/mi.2002.21819bad.005
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
Scribe and break 100-3 for delicate wafers
Scribe and break 100-3 for delicate wafers
Keyword: PESL
The Scribe 100-3 is another machine from Production Equipment Sales Limited (PESL) developed for the new generation of delicate die wafers. High accuracy (1µm resolution) and programmable scribing parameters make it ideal for optical applications such as laser diodes, using Galium Arsonide or Silicon substrates.
Wafer sizes of up to 3" and thickness of 100µm upwards can be accommodated to produce die of 200µm plus. The scribing force is set at a stable low level with programmable speed control and programmable break speed. Indeed the scribe and break parameters are entirely accessible in order to define, step by step, the full scribing sequence. They may then be saved for each customised product (Plate 4).
Plate
4
For contamination control purposes the 100-3 uses a bottom knife and replaceable top nylon film which also allows clean breaking and optimised operational quality. Further information may be found at http://www.pesl.win-uk.net .