Note from the publisher

Citation

(2003), "Note from the publisher", Microelectronics International, Vol. 20 No. 3. https://doi.org/10.1108/mi.2003.21820caa.002

Note from the publisher

Brian Ellis wins Outstanding Service Award at the Literati Awards for Excellence 2003

We are delighted to announce that Brian Ellis, Internet Editor of Circuit World, Microelectronics International and Soldering & Surface Mount Technology, has been awarded an Outstanding Service Award at this year's Literati Awards for Excellence (see www.emeraldinsight.com/literaticlub for further details).

Brian founded the Protonique Group in Switzerland in 1975. The Group addresses the environmental impact of the electronics industry. After ratifying the Montreal Protocol, the Swiss Government invited Brian to represent them on a UN committee to help phase out ozone-depleting solvents. He chaired the electronics section for 12 years. He has also been commissioned by two other UN organisations.

In 1994, Protonique S.A. was one of the first Swiss corporations to have an Internet Web site, written entirely by Brian in HTML code. This mixture of experience led to his being asked to write the regular Internet commentaries in the above Emerald journals. He has received awards from UNEP, US EPA, IPC, and in 1999 he won the Literati Internet Editor of the Year Award. A prolific writer, Brian has written three books, co-authored several more and presented over 200 technical papers throughout the world.

Emerald would like to thank Brian for his long-standing support and consistently high contributions to Circuit World, Microelectronics International and Soldering & Surface Mount Technology.

Best Paper and Best Poster Awards

Microelectronics International recently sponsored the 14th European Microelectronics and Packaging Conference and Exhibition held in Friedrichshafen. Part of this sponsorship involved awarding winners of the three best papers and three best posters with a certificate and a 1 year personal subscription to Microelectronics International.

We are pleased to announce the winners.

Award for Best Papers

"A novel photolithographic method for realizing 3-D interconnection patterns on electronic modules" by T. Nellissen, L. Wang, R. Wehrens, E. van de Heuvel of Philips, The Netherlands.

"A drop-on-demand metal-jet printer for wafer bumpring" by W. Wehl, J. Wild, B. Lemmermeyer of Heilbronn University of Applied Sciences, Germany.

"Through-hole interconnections for Si interposers" by K. Itoi, S. Yamamoto, H. Wada, T. Suemasu, T. Takizawa of Fujikura Ltd, Japan.

Award for Best Posters

"New flip-chip on chip process supercedes embedded technologies" by H. Kostner of DATACON, Austria and H. Hubner of Infineon, Germany.

"Alternative ways to high current structures in LTCC" by A. Albrecht, J. Botiov, K-H. Drue, M. Hintz, H. Wurmus of TU Ilmenau, Germany.

"Optimization of A silicone under the bump structure for wafer level packaging'' by M. Gonzales, B. Vandevelde, M. vanden Bulcke, C. Winters, E. Beyne of IMEC, Belgium, and Y.L. Lee, L. Larson, B. R. Harkness, M. Mohamed and H. Meyen of Dow Chemical.