Attend next year's Pan-Pac

Citation

(1999), "Attend next year's Pan-Pac", Soldering & Surface Mount Technology, Vol. 11 No. 1. https://doi.org/10.1108/ssmt.1999.21911aab.011

Attend next year's Pan-Pac

SMTA

Attend next year's Pan-Pac

The Surface Mount Technology Association (SMTA) and Semiconductor Equipment and Materials International (SEMI) have announced that the fourth annual Pan Pacific Microelectronics Symposium and Exhibition will be held February 2-5, 1999, at the Kaua'i Marriott, Island of Kaua'i, Hawaii.

Focusing on microelectronics packaging, interconnection, and assembly technologies, this symposium features 90 papers, from "Marketing strategies for the new millennium" to "Shear test for flip chip bonding evaluation" and "Fujitsu/Sun processor-based MCM: miniaturization to the extreme". All papers have passed an intensive review process.

The Pan Pacific regularly draws some 200 participants from the Pacific Basin, the Americas, and Europe. Of these participants, according to general chair Dr Koji Nihei of Oki Electric Industry (Japan), "a large percentage carried the title of director, vice president, or president and truly were the decision makers in their companies. The return on your investment of time and money will be long-term business relationships with companies throughout the world".

A special bonus to attendees will be the tabletop exhibition on February 2-5, showcasing the newest products and services from a variety of international companies.

Join us and experience what Bob Marrs, president of Abpac (Phoenix, AZ) calls "a wonderfully organized and relaxing" conference.

For more information about the Pan Pacific Symposium, contact Alyssa Lingor at the SMTA at +1 612-920-7682 or alyssa@smta.org . For information about exhibiting contact Gayle Jackson at +1 540-639-0439 or gayle@smta.org.