Cookson consolidates its electronics divisions

Citation

(2002), "Cookson consolidates its electronics divisions", Soldering & Surface Mount Technology, Vol. 14 No. 2. https://doi.org/10.1108/ssmt.2002.21914bab.008

Cookson consolidates its electronics divisions

Keywords: Cookson, Electronics

Cookson Electronics is renaming its trading businesses to better define the organisation within the industry.

Alpha-Fry Technologies is changing its name to Cookson Electronics Assembly Materials in a move that will more closely align it with its parent company – Cookson Electronics. Similarly, Speedline Technologies and Polyclad/Enthone will become Cookson Electronics Equipment and Cookson Electronics PWB Materials & Chemistries respectively.

Cookson Electronics Assembly Materials brings together all the company's European operations which traded previously under different regional names (Alpha-Fry Technologies; Witmetaal; Rotec; Alpha Metals Lötsysteme; Alpha Sigma etc).

This move reflects Cookson Electronics' drive to strengthen the corporate brand, while raising its profile and visibility in the principal markets – PCB assembly and semiconductor packaging. "The synergy between our companies is unparalleled in the electronics industry," said David Zerfoss, President of Cookson Electronics Assembly Materials. "Their collective global expertise in solder and flux, cleaning processes, laminates and equipment allows Cookson customers to effectively solve their complex manufacturing challenges and optimise production".

The company will drop "Metals" from its Alpha branding to reflect the diversification of products now marketed: "With a wide range of fluxes, polymer adhesives, cleaning chemistries and other peripheral products, a "Metals" tag is no longer 100 per cent appropriate" says Cookson.