Citation
(2012), "Nihon Superior debuts selector guide for SN100C solder pastes", Soldering & Surface Mount Technology, Vol. 24 No. 1. https://doi.org/10.1108/ssmt.2012.21924aaa.007
Publisher
:Emerald Group Publishing Limited
Copyright © 2012, Emerald Group Publishing Limited
Nihon Superior debuts selector guide for SN100C solder pastes
Article Type: Industry news From: Soldering & Surface Mount Technology, Volume 24, Issue 1
Nihon Superior Co. Ltd, a supplier of advanced soldering materials to the global market, introduces the new selector guide for SN100C solder pastes.
The guide includes a detailed list of features for SN100C solder pastes. It includes SN100C P500 D4 for excellent reflow with minimum incidences of solder balling and mid-chip balling, SN100C P520 D5 for excellent reflow on very small pads and chip components down to 01005 (0402 metric), and SN100C P800 D2 low voiding paste for high-reliability assembly. Additionally, the completely halogen-free (completely halogen-free means that it does not contain F, Cl, Br or I) SN100C P602 D4 features minimal incidences of corrosion-induced whiskers.
With a linear ramp to peak temperature of 240°C, SN100C lead-free solder pastes can be reflowed with a similar linear reflow profile to that commonly used with Sn-3.0Ag-0.5Cu even though the melting point of the SN100C alloy is approximately 8°C higher.
To view the list of SN100C solder paste features, visit web site: http://nihonsuperior.co.jp/english/products/html