COMPEL - The international journal for computation and mathematics in electrical and electronic engineering: Volume 10 Issue 3

3D NUMERICAL SIMULATION OF TRANSIENT PROCESSES IN SEMICONDUCTOR DEVICES

A.I. ADAMSONE, B.S. POLSKY

A half‐implicit absolutely stable method for 3D simulation of the transient processes in semiconductor devices is proposed. The calculations of transient processes in bipolar…

NUMERICAL CALCULATIONS OF THERMAL FIELDS IN SUPERCONDUCTING A.C. MAGNET COILS

P. SLANINKA, P. POLJOVKA

This paper deals with a model for the numerical calculations of thermal fields in superconducting a.c. magnet coils. The solution is based on Poisson's partial differential…

ELECTRICAL CHARACTERISTICS OF DUCT ELECTROSTATIC PRECIPITATORS AS INFLUENCED BY BUNDLED DISCHARGE ELECTRODES

S. ABDEL‐SATTAR

In this paper, the electrical parameters of the duct electrostatic precipitators with bundle wires, as discharge electrodes, are calculated and reported. Variation of mobility for…

AN EXTENDED SCHARFETTER‐GUMMEL SCHEME FOR HIGH ORDER MOMENT EQUATIONS

Bernard J. GEURTS

A one‐dimensional finite difference scheme adapted to high order moment equation models arising in the approximate description of semiconducting submicron structures is presented…

A NEW METHOD FOR SOLVING SYSTEMS OF ORDINARY DIFFERENTIAL EQUATIONS OF THE FIRST ORDER

Yu‐Kun FENG

A new method is derived for solving systems of ordinary differential equations of the first order. It is fully explicit, requires no matrix inversion, and shows relatively large…