Table of contents
Thermal time constants of various substrates of integrated circuits
Andrzej KosThe main goal of the work is to show how the kind of substrate and heat sink of integrated circuit or system influences the thermal dynamics of the circuit or system. The…
Flip chip assemblies using gold bumps and adhesive
Zhaowei ZhongThis paper discusses flip chip on FR‐4 and ceramics using non‐conductive adhesive (NCA), anisotropic conductive film (ACF), or anisotropic conductive paste (ACP). Several ACF and…
The impact of lead‐free soldering on electronics packages
L. Yang, J.B. Bernstein, K. ChungThis paper will review the challenges brought by lead‐free soldering and some preliminary experimental evaluation results will be discussed. The initial results show that the…
The evaluation of different base materials for high density flip chip on flex applications
Petteri Palm, Jarmo Määttänen, Alain Picault, Yannick De MaquilléThis paper presents the results from the evaluation of different types of flexible substrates for high‐density flip chip application. In this work two different types of base…
Gravure offset printing development for fine line thick film circuits
Juha Hagberg, Marko Pudas, Seppo Leppävuori, Ken Elsey, Alison LoganThe resolution of conventional graphical gravures is limited to about 50 to 100 microns depending on the technology used. For these gravures the depths are dependent on the widths…
High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM‐SL/D)
Eric Beyne, Rita Van Hoof, Tomas Webers, Steven Brebels, Stéphanie Rossi, François Lechleiter, Marianna Di Ianni, Andreas OstmannA novel interconnect technology, introducing thin film on a laminate substrate base, is presented. A specially constructed laminate board is used as a substrate for the thin film…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson