Table of contents
Realizing high‐voltage thin film lateral bipolar transistors on SOI with a collector‐tub
Sukhendu Deb Roy, M. Jagadesh KumarThe main purpose of this paper is to find a simple method to improve the breakdown voltage of BJTs fabricated on SOI.
Optimization of fins used in electronic packaging
Kang Eu Ong, Kor Oon Lee, K.N. Seetharamu, I.A. Azid, G.A. Quadir, Z.A. Zainal, Teck Joo GohTo find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation.
Study of avalanche breakdown (MI) mode in sub micron MOSFET device
A.K. SinghTo study the breakdown (MI) mechanism in the sub‐micron MOSFET device.
Size dependent leaf overlay effects on thin film microstrip patch antenna
Vijaya Puri, S.M. Salunkhe, M.M. PuranikUse of thin film microstrip patch antenna for leaf moisture studies.
Geometrical and electrical properties of LTCC and thick‐film microresistors
Andrzej Dziedzic, Edward Mis, Lars Rebenklau, Klaus‐Jurgen WolterThis paper aims to present systematic studies of a wide spectrum of geometrical and electrical properties of thick‐film and LTCC microresistors (with designed dimensions between…
Thermal deformation analysis of BGA package by digital image correlation technique
J. Zhang, M. Li, C.Y. Xiong, J. Fang, S. YiThe mismatch of the thermal expansion coefficients of the materials in multiplayer structure may induce serious stress concentrations in electronic packaging. Experimental…
Repeater insertion in global interconnects in VLSI circuits
Rajeevan Chandel, S. Sarkar, R.P. AgarwalDelay and power dissipation are the two major design constraints in very large scale integration (VLSI) circuits. These arise due to millions of active devices and…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson