Table of contents
A Photoimageable Dielectric for Sequential PWB Fabrication
P.D. Knudsen, R.L. Brainard, K.T. SchellAs printed wiring boards move to thin laminate structures, there is growing interest in the use of photoimageable coatings to serve as dielectric. Shipley has developed a liquid…
A New Strategy in the Recycling of Printed Circuit Boards
J.B. Legarth, L. Alting, B. Danzer, D. Tartler, K. Brodersen, H. Scheller, K. FeldmannThe resource parameter in life cycle assessments is used to evaluate present efficiency in resource recovery from printed circuit boards. It is shown that only a fraction of the…
Flip Chip Rework Process
S.V. Vasan, P.T. Truong, G. DodyThis paper discusses chip removal and replacement processes of flip chip assemblies (FCAs) on printed wiring boards (PWBs). The original chip connection is achieved via mass…
Design and Procurement of Eutectic Sn/Pb Solder‐bumped Flip Chip Test Die and Organic Substrates
J. Lau, M. Heydinger, J. Glazer, D. UnoA case study was conducted to investigate the issues associated with the design and procurement of flip chip test die and corresponding organic substrates. Test wafers were…
Characterisation and Evaluation of the Underfill Encapsulants for Flip Chip Assembly
B. Wun, J. LauStudies of solder‐bumped flip chips on organic substrates reported in the literature have so far suggested the necessity of a polymeric underfill to compensate for the large…
The Adhesion Promotion and Metallisation Process: The Critical Step in MID Manufacturing
P. HunterLike the conventional PCB, the Moulded Interconnect Device (MID), be it 2‐ or 3‐dimensional, will have, as its interconnection medium, conductive patterning or structuring upon…
X‐ray Inspection of Flip Chip Attach Using Digital Tomosynthesis
S. Rooks, T. SackTo accommodate increasing levels of device integration at the chip level, circuit line densities in electronic packages are continually increasing. Greater circuit line density…
High Strength, Low Profile Copper Foil for High Performance PCBs
S.K. Chiang, D.F. DiFranco, D.G. PucciA new high strength, low profile copper foil (AM) has been developed by the authors' company. This foil is designated AM foil, which refers to its advanced metallurgy. The unique…
PCIF News
A trade federation. An umbrella organisation representing the electronics interconnection industries in the global market place.
International institute news
With a 20‐month gap before the next CEMEX show, the Association has turned its attention to marketing support for members exporting goods and services.
Industry news
LeaRonal (UK) plc of Buxton, Derbyshire, specialists in plating and allied services to the printed circuit board industry, has appointed John Flynn to their technical staff. Mr…
New products
The universal Tecfoil frame uses interchangeable Tecfoil stencils, removing the need for each stencil to be frame mounted. Tecfoils are quickly attached by placing them on…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari