Table of contents
PCB‐design follows IC‐packaging
J. Kloeser, W. ScheelThe evolution of IC manufacturing technology has led to a decrease in feature size on the silicon die from around 2μm nowadays down to 0.18μm, and in the near future down to…
Immersion tin as a high performance solderable finish for fine pitch PWBs
David H. OrmerodA new high performance immersion tin incorporating a co‐deposited organic provides a highly solderable PWB surface finish. The process is described and includes solderability…
Competitive PWB manufacturing: what is needed to maintain a viable industry in Europe?
Philip BrittonThere are an increasing number of predictions on the future of the European PWB manufacturing industry stating that Europe is becoming increasingly uncompetitive in the field of…
Erratum
This article has been withdrawn as it was published elsewhere and accidentally duplicated. The original article can be seen here: 10.1108/09540919810237039. When citing the…
Environmental best practice in the PCB industry
Martin GooseyThe need for the printed circuit board (PCB) industry to minimise its environmental impact is increasingly important, not only because of public lobbying but also because of the…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari