Table of contents
The development of a system for measuring material deformation during the bonding of multilayer printed circuit boards
Keith Sargent, Adam SpillerDuring the bonding of multi‐layer printed circuit boards (PCBs) the individual layers tend to distort, causing the feature positions to move. While the results of the bonding…
Laser direct imaging and improved process capability
Steve Jones, Andrew KelleyA detailed multi‐site study has been undertaken to determine the variation in the positional accuracy of circuit features in the manufacture of large panel High‐Density…
Application of simulation tools for the technology‐driven planning of a PCB‐production line
Klaus Feldmann, Frank ChristophThe production of printed circuit boards (PCB) is facing considerable challenges concerning the demand for higher interconnection density and environmental friendliness. These…
Embedded passive technology for networking systems
Gareth D. Jones, John LaufferParticularly during the past ten years, the mobile communications industry has grown by orders of magnitude, fueled by digital and RF circuit fabrication improvements, new large…
Imprint patterning: a novel method for producing high density interconnects
George GregoireImprint patterning is a new circuit formation process that is based on a well‐established technology called microreplication. Microreplication has been used for many years for…
Properties of new printed circuit board base materials
Sylvia EhrlerCurrently, the most widely used Printed Circuit Board (PCB) base material is the glass reinforced epoxy known as FR‐4. To improve the electrical or the thermomechanical…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari