Table of contents
Assessment of risk resulting from unattached tin whisker bridging
Tong Fang, Sony Mathew, Michael Osterman, Michael PechtThis paper aims to present a methodology for estimating the risk of component level electrical bridging failures from unattached conductive (tin) whiskers.
Tin pest in electronics?
W.J. PlumbridgeTo review the literatures, and to consider the latest results regarding the formation of tin pest in lead‐free solders and interconnections.
Failure analysis of electronic components and interconnection systems
C.A. SmithThe failure analysis of electronic components and interconnection systems such as integrated circuits, printed circuit board assemblies, and hybrid devices is discussed.
Challenges in the manufacture of glass substrates for electrical and optical interconnect
David A. Hutt, Karen Williams, Paul P. Conway, Fuad M. Khoshnaw, Xiaoyun Cui, Deepa BhattTo present the aims and preliminary findings of a research project to investigate the manufacture of multilayer glass substrates built up from thin glass sheets.
Lithographically printed voltaic cells – a feasibility study
Darren Southee, Gareth I. Hay, Peter S.A. Evans, David J. HarrisonIt has been shown that circuit interconnects and various passive components can be fabricated on a variety of flexible substrates using the offset lithographic process. This paper…
“System in package technology” – design for manufacture challenges
Andrew Richardson, Chris Bailey, Jean Marc Yanou, Norbert Dumas, Dongsheng Liu, Stoyan Stoyanov, Nadia StrusevichTo present key challenges associated with the evolution of system‐in‐package technologies and present technical work in reliability modeling and embedded test that contributes to…
Implementation of the RoHS directive and compliance implications for the PCB sector
Martin GooseyTo present an overview of the current status of the RoHS directive and its implications for the printed circuit board (PCB) industry.
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari