Table of contents
How to make chip integration technology suitable for high volume production
Thomas Gottwald, Ulrich OckenfußThis paper aims to present an overview of existing component embedding methods and to show the differences of the new embedding method called SEAG iBoard.
Modeling of multi‐layer circuit boards by using a model of bi‐phase and elasto‐plastic plies
K.H. Low, Yuqi WangThe paper aims to present a modeling method for multi‐layer, multi‐material printed circuit boards (PCBs) in both micro‐structure and board levels.
Prognostics of ceramic capacitor temperature‐humidity‐bias reliability using Mahalanobis distance analysis
Lei Nie, Michael H. Azarian, Mohammadreza Keimasi, Michael PechtThis paper seeks to present a prognostics approach using the Mahalanobis distance (MD) method to predict the reliability of multilayer ceramic capacitors (MLCCs) in…
The evaluation of sonochemical techniques for sustainable surface modification in electronic manufacturing
Andy Cobley, Tim MasonThis paper sets out to give an introduction to sonochemistry and the effects brought about by the application of ultrasound that might be useful in surface modification; and to…
The importance of standards for PCBs when doing business in Europe
Michael WeinholdThis paper seeks to present an overview of the importance of standards for PCBs when doing business in Europe and to provide information that will enable a better understanding of…
Chemical characterisation of materials in electronic systems using infrared spectroscopy
C.A. SmithThe purpose of the paper is to discuss the chemical characterisation of inorganic and organic materials found in electronic systems.
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari