Circuit World: Volume 36 Issue 2

Integrated optical and electronic interconnect PCB manufacturing research

David R. Selviah, Andy C. Walker, David A. Hutt, Kai Wang, Aongus McCarthy, F. Anibal Fernández, Ioannis Papakonstantinou, Hadi Baghsiahi, Himanshu Suyal, Mohammad Taghizadeh, Paul Conway, John Chappell, Shefiu S. Zakariyah, Dave Milward, Richard Pitwon, Ken Hopkins, Malcolm Muggeridge, Jeremy Rygate, Jonathan Calver, Witold Kandulski, David J. Deshazer, Karen Hueston, David J. Ives, Robert Ferguson, Subrena Harris, Gary Hinde, Martin Cole, Henry White, Navin Suyal, Habib ur Rehman, Chris Bryson

The purpose of this paper is to provide an overview of the research in a project aimed at developing manufacturing techniques for integrated optical and electronic interconnect…

Chemical “kick start” for the autocatalytic formaldehyde‐free electroless copper plating process

Edith Steinhäuser, Lutz Stamp, Lutz Brandt

The purpose of this paper is to examine the use of additives in formaldehyde‐free copper‐plating solutions with low reducing agent (RA) concentration to improve the start reaction…

Laser processing of materials: a new strategy toward materials design and fabrication for electronic packaging

Rabindra N. Das, Frank D. Egitto, Voya R. Markovich

Material formulation, structuring and modification are key to increasing the unit volume complexity and density of next generation electronic packaging products. Laser processing…

New lifecycle monitoring system for electronic manufacturing with embedded wireless components

Axel Bindel, Paul Conway, Laura Justham, Andrew West

The purpose of this paper is to present an update of and the latest results from work on a project aimed at monitoring electronic products during the whole life cycle with…

Printing technology for ubiquitous electronics

Jayna R. Sheats, David Biesty, Julien Noel, Gary N. Taylor

The purpose of this paper is to analyze the economics of various printing processes proposed for small‐scale electronic products such as radio frequency identification tags, smart…

EIPC announce new IEC Standards for the PCB industry

Capacity for preparation of advanced electronic devices

Park Electrochemical appointed Jean-Francois Le Rouzic to Director of Marketing and Sales of all the Corporation’s product lines in Europe and Mark Carlson to Director of Global RF Marketing

AT&S and Solland Solar to build prototype production line for photovoltaic modules with Sunweb® back-contacted solar cells

Good quality and high reliability are not an accident!

Pete Starkey

IeMRC – CAFMAD Workshop on Novel Electronic Materials

Martin Goosey

Graphic plc to save operational costs with Orbotech Sprint-8 inkjet legend printer

EIPC Winter Conference

J.H. Ling

New CEMCO immersion silver line for Thales Netherlands

Packaging and Interconnection for Electronics and Sensors – Past, Present and Future. A seminar to mark the retirement of David Pedder

Martin Goosey

New HASL line for Sulakshana Circuits, India

Wrekin Circuits Limited: a profile

Aspocomp Oulu expands laser direct imaging capabilities with Orbotech’s New ParagonTM-SM 20

AT&S Austria appoints new chairman

Polar adds Speedflex flex-rigid PCB capability to the Speedstack layer stackup design system

International diary

EIPC-IONMET Workshop: Ionic Liquid Plating Technologies in Development. Silver and Gold Final Finishes for PCBs

Pete Starkey

UK electronics manufacturers industry – what is in store for 2010?

EIPC-EBFRIP Seminar,

J.H. Ling

Invotec awarded AS9100

Editorial

Martin Goosey

Institute of Circuit Technology High Performance Laminates Seminar

Richard Wood-Roe