Soldering & Surface Mount Technology: Volume 1 Issue 3

Editorial

BOB WILLIS

How can the industry using Surface Mount Technology obtain the highest yields? How can we eliminate rework and repair? How can a company obtain a consistent approach to a change…

Research on the Mechanism of Thermal Fatigue in Near‐eutectic Pb‐Sn Solders

J.W. Morris, D. Grivas, D. Tribula, T. Summers, D. Frear

This paper discusses the microstructures of solder joints and the mechanism of thermal fatigue, which is an important source of failure in electronic devices. The solder joints…

An Engineering Approach to Thermal‐stress Analysis in SMT Applications

D.E. Riemer

This paper introduces thermal‐stress analysis methods which follow electrical engineering procedures. The spring constant or c‐value is found to be related to the electrical…

Fatigue Failure in a Model SMD Joint

A.C. Chilton, M.A. Whitmore, W.B. Hampshire

A model SMD test‐piece has been developed which permits mechanical stressing of a solder joint in a similar mode to that occurring in the process of thermal fatigue. The failure…

Recent Component Solderability Test Enhancements

W.R. Russell, B.M. Waller, P.S. Barry, W.M. Wolverton

Critical parameters of the MIL‐STD‐202 Method 208 and MIL‐STD‐883 Method 2003 component solderability tests were determined from laboratory experiments. Among the variables…

Moisture Induced Failure in Plastic Surface Mount Packages

C. Lea, D. Tilbrook

There is a reliability concern in the larger plastic surface mounting packages which can exhibit cracks from internal stresses during soldering. A lot of ad hoc information has…

SMT—Wave Soldering, Adhesives and Mixed Technology

C.D. Holder

With the increased functional density requirements of military avionics it is impossible to meet these demands without utilising Surface Mount Technology. The Electronics…

Capacitor Cracking due to Thermal Shock in Wave Solder Processing

J.M. Anderton, S.G. Warrens

Increased use of surface mount ceramic capacitors in wave solder applications has resulted in a number of field failures due to migration of microcracks through the capacitor…

Solder Joint Failure Detection: Does Inspection Assure Reliability?

J. Keller

Solder joint failures in military missile systems and commercial communication products were investigated. The study was initiated after it had been determined that visual PWBA…

SMD Soldering — Direction and Time of Heating

H. Briken

In many cases people talk about reflow soldering and do not mention the parameters. It is therefore difficult to judge results. The old struggle persists between vapour phase…

ACT Two‐day Seminar — Repair, Rework and Modification of Surface Mounted Assemblies: Irvine, Scotland, 12–13 July

Lorna Cullen

It made a pleasant change to travel a mere 15 miles from base to report on the above two‐day event held at The Hospitality Inn, Irvine. Bypassing Troon en route, and glimpsing the…

Multicore Solders (Malaysia), SDN, BHD, Ipoh, Malaysia

Brian N. Ellis

This profile is somewhat more exotic than the usual ones found in this, hopefully, august journal and your reporter would like to dwell on the background more than is usual. If…

SMART group news

Since its early conception, the group has grown from a handful of enthusiastic engineers to the largest trade association in Europe, if not the world, for Surface Mount. As in…

Industry news

Alan Moore has been appointed Lead Engineer at surface mount subcontractors EDMS of Maldon. With extensive knowledge of both surface mount and conventional PCB design and…

New Products

Dynapert Ltd of Colchester have announced the introduction of a new ‘starter’ package for their production proven MPS318.