Soldering & Surface Mount Technology: Volume 10 Issue 3

Influences of storage conditions on component cracking

Klaus Feldmann, Robert Feuerstein, Knuth Götz

At the Institute for Manufacturing Automation and Production Systems (FAPS), in Erlangen, Germany, the influence of different storage conditions on cracking behaviour of…

Finite element modelling of printed circuit boards (PCBs) for structural analysis

Miky Lee

Considers a process for better mechanical design of printed circuit boards (PCBs) which suffer from warpage during the assembly process. During the reflow process, PCBs experience…

Gallium‐based interconnects for flip‐chip assembly

Adam A. Stanfield

A feasibility study into alternative methods of producing interconnection between a PCB and flip‐chip has been undertaken. A number of initial ideas were investigated, the least…

Verification of flip‐chip assembly on FR4 boards

Caroline Beelen‐Hendrikx, Martin Verguld

As a result of the trend towards portable communication products, low‐cost miniaturisation is becoming increasingly important. One of the methods to achieve low‐cost…

Eutectic Sn/Pb solder bump and under bump metallurgy: interfacial reactions and adhesion

Se‐Young Jang, Kyung‐Wook Paik

In flip‐chip interconnection on organic substrates using eutectic tin/lead solder bumps, a highly reliable under bump metallurgy (UBM) is required to maintain adhesion and solder…

The role of intermetallic compounds in lead‐free soldering

Paul G. Harris, Kaldev S. Chaggar

The role of intermetallics in soldered joints is ambivalent. They are an essential part of joints to common basis materials and at low levels they have a strengthening effect on…