Table of contents
A high‐performance lead‐free solder – the effects of In on 99.3Sn/0.7Cu
Jennie S. Hwang, Zhenfeng Guo, Holger KoenigsmannWith the established surface mount infrastructure and the temperature constraints of components and printed circuit boards, the melting temperatures of lead‐free solder alloys…
Bending and twisting of cylindrical solder interconnections with creep
John H. LauAn exact analysis is presented of the creep deformation of cylindrical solder interconnects subjected to the actions of bending moments, twisting moments, and axial forces…
Reliability of FCOB with and without encapsulation
Zhaowei ZhongFlip chips were assembled on to ceramic boards using eutectic tin‐lead solder with underfill and with/without encapsulation for temperature cycling and…
Effects of Pb contamination on the eutectic Sn‐Ag solder joint
S. Choi, T.R. Bieler, K.N. Subramanian, J.P. LucasEutectic Sn‐Ag solder is being considered as a potential replacement for Sn‐Pb solders. A potential drawback to using the eutectic Sn‐Ag solder is its higher melting point, 221°C…
Critical factors affecting paste flow during the stencil printing of solder paste
R. Durairaj, T.A. Nguty, N.N. EkereThe paste printing process accounts for the majority of assembly defects, and most defects originate from poor understanding of the effect of printing process parameters on the…
Stud bump bond packaging with reduced process steps
Zhaowei ZhongThe stud bump bonding (SBB) process was evaluated for a flip chip in package application. An SBB packaging process, having a reduced number of process steps compared with the…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang