Table of contents
Improving the fatigue life of a bare die flip chip by thinning
T. Alander, I. Suominen, P. Heino, E. RistolainenThe solder joint reliability of FC components on organic substrates is questionable unless underfill is used to relieve the thermal strains. Besides the mechanical protection…
Flip chip solder joint reliability under harsh environment
Cheng Bo, Wang Li, Zhang Qun, Gao Xia, Xie Xiaoming, Wolfgang KempeFlip chip solder joint reliability under thermal shock stress was investigated both experimentally and by 2D finite element simulation. The results indicate that solder fatigue is…
Mechanical characterization of Sn‐3.5Ag solder joints at various temperatures
H. Rhee, K.N. Subramanian, A. Lee, J.G. LeeDeformation studies on eutectic Sn‐Ag solder (Sn‐3.5Ag in wt percent) joints were carried out at a range of temperatures using a rheometric solids analyzer (RSA‐III). Various…
Failures of flip chip assemblies under thermal shock
Cheng Bo, Wang Li, Zhang Qun, Gao Xia, Xie Xiaoming, Wolfgang KempeFlip chip on board (FCOB) solder joint reliability under thermal shock stress was investigated. With underfill materials, the solder joint lifetime was increased from 37 to…
Thermal strain analysis of an electronics package using the SEM Moiré technique
Z.W. Zhong, S.K. NahThis paper reports on a study of the scanning electron microscope (SEM) Moiré method. Tests were carried out by rotating the specimen grating slightly with respect to the electron…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang