Table of contents
Long term mechanical reliability with lead‐free solders
W.J. PlumbridgeThe decision to move to lead‐free solders has been made, but processing and performance challenges remain. This paper considers the transition in terms of performance, with…
Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate
Eric C.C. Yan, S.W. Ricky Lee, X. HuangThis paper presents an experimental study to assess the reliability of solder ball attachment to the bond pads of PBGA substrate for various plating schemes. The basic structure…
Strategies for improving the reliability of solder joints on power semiconductor devices
Guo‐Quan Lu, Xingsheng Liu, Sihua Wen, Jesus Noel Calata, John G. BaiIn this paper, some strategies taken to improve the reliability of solder joints on power devices in single device and multi‐chip packages are presented. A strategy for improving…
CBGA solder joint thermal fatigue life estimation by a simple method
T.E. Wong, C.Y. Lau, H.S. FengerA simple analysis method was developed to determine the fatigue life of a ceramic ball grid array (CBGA) solder joint when exposed to thermal environments. The solder joint…
Reliability testing and data analysis of lead‐free solder joints for high‐density packages
John Lau, Nick Hoo, Rob Horsley, Joe Smetana, Dongkai Shangguan, Walter Dauksher, Dave Love, Irv Menis, Bob SullivanTemperature cycling tests, and statistical analysis of the results, for various high‐density packages on printed‐circuit boards with Sn‐Cu hot‐air solder levelling, electroless…
Failure analysis of lead‐free solder joints for high‐density packages
John Lau, Dongkai Shangguan, Todd Castello, Rob Horsley, Joe Smetana, Nick Hoo, Walter Dauksher, Dave Love, Irv Menis, Bob SullivanFailure analyses of the lead‐free and SnPb solder joints of high‐density packages such as the plastic ball grid array and the ceramic column grid array soldered on SnCu hot‐air…
Thermal cycling reliability of lead‐free chip resistor solder joints
Jeffrey C. Suhling, H.S. Gale, R. Wayne Johnson, M. Nokibul Islam, Tushar Shete, Pradeep Lall, Michael J. Bozack, John L. Evans, Ping Seto, Tarun Gupta, James R. ThompsonThe solder joint reliability of ceramic chip resistors assembled to laminate substrates has been a long time concern for systems exposed to harsh environments. In this work, the…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang