Table of contents
The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints
Meng‐Kuang Huang, Chiapyng Lee, Pei‐Lin Wu, Shyh‐Rong TzanThe effects of thermal fatigue and printed circuit board (PCB) surface finish on the pull strength, failure modes and reliability of chip scale package (CSP) solder joints were…
Effect of SnAgCu composition on soldering performance
Benlih Huang, Arnab Dasgupta, Ning‐Cheng LeeTombstoning and voiding have been plaguing the surface mount assembly industry for decades. The recent global move toward lead‐free soldering and the extensive adoption of…
The effect of thermal cycling on the contact resistance of anisotropic conductive joints
L. Ali, Y.C. Chan, M.O. AlamAnisotropic conductive film (ACF) offers miniaturization of package size, reduction in interconnection distance and high performance, cost‐competitive packaging and improved…
Solder joint reliability in AgPt‐metallized LTCC modules
Olli Nousiaianen, Risto Rautioaho, Kari Kautio, Jussi Jääskeläinen, Seppo LeppävuoriTo investigate the effect of the metallization and solder mask materials on the solder joint reliability of low temperature co‐fired ceramic (LTCC) modules.
Application of a design of experiments approach to the reliability of a PBGA package
Ji Hyuck Yang, Kang Yong LeeTo apply the design of experiments (DOE) methodology to the problem of cracking of plastic ball grid array (PBGA) packages during the reflow soldering process.
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang