Soldering & Surface Mount Technology: Volume 21 Issue 1

Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayer

The aim of the paper is to study the feasibility of direct ultrasonic bonding between contact pad arrays on flexible printed circuit boards (FPCB) and rigid printed circuit boards…

Optimisation modelling for thermal fatigue reliability of lead‐free interconnects in fine‐pitch flip‐chip packaging

This paper aims to present an integrated optimisation‐modelling computational approach for virtual prototyping that helps design engineers to improve the reliability and…

Geometry control of solder interconnects via induction heating

The aim of the paper is to control the height and shape of solder interconnects employed in electronic packaging applications by an induction heating reflow method, which can…

Lead‐free solder joint reliability estimation of flip chip package using FEM‐based sensitivity analysis

Integration of Cu/low‐k interconnects into the next‐generation integrated circuit chips, particularly for devices below the 90 nm technology node, has proved necessary to meet the…

DEK boosts throughput and flexibility with new Dual Lane RTC platform

New Universal AdVantisX from Contax – Genesis Technology on a Budget

ESTC 2008 – 2nd Electronics System Integration Technology Conference, 1-4 September 2008, The University of Greenwich, London

Second generation C5 from Contax cost-effective high throughput placement system

ASML Supervisory Board nominates Pauline van der Meer Mohr as new member

DEK extends Instinctiv™ V9 software capabilities with 2D inspection control

IET to sign up with UKRC’s CEO charter

Editorial

HumiSeal® redefines conformal coating selection with launch of industry leading website

Novatec continues their tradition of breakthrough technologies at Forum de l’electronique

High bar count metal encoder disks enable accurate optical measurement and control

New OK International Multi-Function Rework System provides process control, value and flexibility

ThreeBond 30F-404 UV/visible light cure adhesive

International diary

Intertronics – fine mist lubricant system

OK International appoints new China Sales Director

Surface mounting (the equine version) from Intertronics

DEK solar offers fast-track to efficient commercial photovoltaic production

Advanced directory solves the problems of solder stencil efficiency

Low-cost Panasonic CM101 modular placement machine wins tough selection battle at Murata Power Solutions