Table of contents
Thermophysical properties and wetting behavior on Cu of selected SAC alloys
Przemyslaw Fima, Tomasz Gancarz, Janusz Pstrus, Krystyna Bukat, Janusz SitekThe purpose of this paper is to study the effect of copper concentration in near‐eutectic liquid SAC solders on their thermophysical properties: viscosity, surface tension…
Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process
Chun‐Sean Lau, M.Z. Abdullah, F. Che AniThe purpose of this paper is to develop a thermal coupling method of a ball grid array (BGA) assembly during a forced convection reflow soldering process.
Finite element analysis of flip – chip on board (FCOB) assembly during reflow soldering process
Annapurna Addagarla, N. Siva PrasadOut‐of‐plane displacement (warpage) is one of the major thermomechanical reliability concerns for board‐level electronic packaging. The warpage and residual stresses can cause…
Thermo‐mechanical behaviour of DBC substrate assemblies subject to soldering fabrication processes
Duncan CamilleriPower electronics are usually soldered to Al2‐O3 direct‐bond‐copper (DBC) substrates to increase thermal diffusivity, while at the same time increasing electrical isolation…
Robot‐based resistance soldering of optical components
Alexander Gatej, Nicolas Pyschny, Peter Loosen, Christian BrecherLaser systems are becoming more and more a commodity in many fields of application and this is driving a strong trend towards increasingly efficient production technologies and…
Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test
Xin Li, Gang Chen, Xu Chen, Guo‐Quan Lu, Lei Wang, Yun‐Hui MeiThe purpose of this paper is to evaluate the mechanical properties of nano‐silver paste sintered lap shear structures and to discuss the effects of loading rate and ambient…
Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds
Lutz Merkle, Marcus Sonner, Matthias PetzoldThe purpose of this paper is to establish a law on the durability of thick aluminium wire bonds in low cycle fatigue for different geometries and wire diameters under a purely…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang