Soldering & Surface Mount Technology: Volume 27 Issue 2

Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering

Attila Geczy, Márta Fejos, László Tersztyánszky

This paper aims to reveal the causes and find an efficient method to compensate the shrinkage to reduce failure costs. Reflow-induced printed circuit board (PCB) shrinkage is…

Advancement in microstructure and mechanical properties of lanthanum-doped tin-silver-copper lead free solders by optimizing the lanthanum doping concentration

Bakhtiar Ali

The purpose of this paper is to analyze the effect of lanthanum (La) doping on the microstructure and mechanical properties of tin-silver-copper (SAC) alloys and to find out an…

Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cycling

Jibing Chen, Yanfang Yin , Jianping Ye, Yiping Wu

The purpose of this paper is to investigate the thermal fatigue behavior of a single Sn-3.0Ag-0.5Cu (SAC) lead-free and 63Sn-37Pb (SnPb) solder joint treated by rapidly…

Dissolution kinetics of copper in lead-free liquid solders

Mohammad Faizan

– The purpose of this paper was to develop a physics-based mathematical model to estimate the amount of substrate metal lost during the wet soldering process.

Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. % W barrier film by nanoindentation

C.S. Chew, R. Durairaj, A. S. M. A. Haseeb, B. Beake

The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. % W alloy film by nanoindentation…