Table of contents
Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters
Hao Zou, Fang Xie, Bo Du, G. KavithaaThe purpose of this paper is to find the optimum inverter type as the solder joint reliability point of view.
Cleaning control of stencil printing subject to performance deterioration
Rui Xi, Jiangyou Yu, Le Cao, Xiaojiang Zheng, Jun GuoMost solder paste printers are configured to periodically clean the stencil to maintain printing quality. However, a periodical cleaning control may result in excessive cleaning…
Effect of Sb additions on the creep behaviour of low temperature lead-free Sn–8Zn–3Bi solder alloy
Guang Ren, Maurice CollinsThis paper aims to investigate the creep behaviour of the recently developed Sn–8Zn–3Bi–xSb (x = 0, 0.5, 1.0 and 1.5) low temperature lead-free solder alloys.
An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems
Feng Wang, Fangfang Zhang, Qixiang Huang, Mohammad SalmaniThe purpose of this paper is to propose a method with capability of short-time implementation.
Thermal-mechanical reliability analysis of WLP with fine-pitch copper post bumps
Haiyan Sun, Bo Gao, Jicong ZhaoThis study aims to investigate the several parameters in wafer-level packaging (WLP) to find the most critical factor impacting the thermal fatigue life, such as the height of…
Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling
Buen Zhang, Noor H. Jabarullah, Ayad F. Alkaim, Svetlana Danshina, Irina V. Krasnopevtseva, Yuan Zheng, Nisith GeethaThis paper aims to establish a more accurate model for lifetime estimation.
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang