Soldering & Surface Mount Technology: Volume 35 Issue 5

Reflow profiling with the aid of machine learning models

Yangyang Lai, Seungbae Park

This paper aims to propose a method to quickly set the heating zone temperatures and conveyor speed of the reflow oven. This novel approach intensely eases the trial and error in…

Interfacial behavior and mechanism of brazed diamond with CeO2-added Ni-Cr filler alloy: a combined first-principles and experimental study

Ao Zhang, Jian Zhang, Mingjun Zhang, Junyi Liu, Ping Peng

This paper aims to investigate the effect and mechanism of O atom single doping, Ce and O atoms co-doping on the interfacial microscopic behavior of brazed Ni-Cr/diamond.

Electrical, morphological, optical and mathematical simulations equations studies in CAZO, CZO, AZO and ZNO films

Vali Dalouji, Nasim Rahimi

In this paper, it can be seen from AFM images of the as-deposited ZnO and CZO films, and the particle size and shape are not clear, while by increasing annealing temperature, they…

Data-driven electronic packaging structure inverse design with an adaptive surrogate model

Shaoyi Liu, Song Xue, Peiyuan Lian, Jianlun Huang, Zhihai Wang, Lihao Ping, Congsi Wang

The conventional design method relies on a priori knowledge, which limits the rapid and efficient development of electronic packaging structures. The purpose of this study is to…

Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process

Zuraihana Bachok, Aizat Abas, Hehgeraj A/L Raja Gobal, Norwahida Yusoff, Mohamad Riduwan Ramli, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani, Muhamed Abdul Fatah Muhamed Mukhtar

This study aims to investigate crack propagation in a moisture-preconditioned soft-termination multi-layer ceramic capacitor (MLCC) during thermal reflow process.

Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents

Mohammad A. Gharaibeh, Faris M. Al-Oqla

There are several lead-free solder alloys available in the industry. Over the years, the most favorable solder composition of tin-silver-copper (Sn-Ag-Cu [SAC]) has been vastly…

Early wetting and interfacial behavior of Sn-based solder on copper substrates with different roughness

Yuzhu Han, Jieshi Chen, Shuye Zhang, Zhishui Yu

This paper aims to investigate the effect of solder composition and roughness on early wetting behavior and interfacial reaction under atmospheric conditions.