Soldering & Surface Mount Technology: Volume 36 Issue 1

Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage

Meng Jiang, Yang Liu, Ke Li, Zhen Pan, Quan Sun, Yongzhe Xu, Yuan Tao

The purpose of this paper is to study the reliability of sintered nano-silver joints on bare copper substrates during high-temperature storage (HTS).

Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding

Chen Chen, Liang Zhang, Xi Huang, Xiao Lu

The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and…

Flow behavior during solder/Cu column friction plunge micro-welding

Zhili Zhao, Mingqiang Zhang, Xi Meng, Zhenkun Li, Jiazhe Li, Luying Qiu, Zeyu Ren

The author proposed a friction plunge micro-welding (FPMW) method and applied it to column grid array packaging to realize the connection of copper columns without precision molds…

Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple

Andromeda Dwi Laksono, Chih-Ming Chen, Yee-Wen Yen

The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP)…

Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere

Bifu Xiong, Siliang He, Jinguo Ge, Quantong Li, Chuan Hu, Haidong Yan, Yu-An Shen

This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints…

Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing

Mohamad Solehin Mohamed Sunar, Maria Abu Bakar, Atiqah A., Azman Jalar, Muhamed Abdul Fatah Muhamed Mukhtar, Fakhrozi Che Ani

This paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing.

Deep learning and analytical study of void regional formation in flip-chip underfilling process

Calvin Ling, Muhammad Taufik Azahari, Mohamad Aizat Abas, Fei Chong Ng

This paper aims to study the relationship between the ball grid array (BGA) flip-chip underfilling process parameter and its void formation region.