Soldering & Surface Mount Technology: Volume 4 Issue 1

Empirical Modelling of Surface Mount Solder Joints from 132 Pin Quad Flat Pack Components

N. Brady, T.J. Ennis

Tensile pull strength tests were used to study the strength of solder joints of 25 mil gull wing leads on 132 pin quad flat pack components. The authors generated quadratic and…

A Comparison of Laser Types for Reflow Soldering

S.B. Dunkerton

The increasing complexity of microelectronic devices and the advent of surface mount technology has led to interest in alternatives to mass reflow soldering techniques. One method…

Analysis of the Ball‐forming Process in Copper Ball Bonding

F. Hongyuan, Q. Yiyu, J. Yihong

Pulse control, SEM analysis and metallographic examination have been used to record and study the process by which a ball is formed at the tip of an ultra‐fine copper wire. The…

Figures of Merit Design Tools for Surface Mount Solder Joint Reliability

W. Engelmaier

In early 1989 the original version of the Reliability Figures of Merit (FM) for the solder attachments of surface mount (SM) assemblies was published. That version of the FM was…

The Use of Bismuth Alloy Systems for Reflow and Wave Soldering

A. Nicholson, D. Bloomfield

In view of the increasing interest in low temperature and lead‐free solder alloys, a review was made of existing information on the physical properties of bismuth alloys suitable…

Diffusion Soldering

D.M. Jacobson, G. Humpston

Soldering and diffusion bonding each have benefits and drawbacks. Solders are capable of bridging joints of irregular geometry but the joints tend to have significant void levels…

Water‐rinsable or so‐called ‘No Clean’ Solder Pastes? The Attempt of a Comparison from the Technical and Environmental Viewpoint

W. Leske, J. Koch

In SMD as well as in hybrid manufacturing processes, considerable quantities of CFC are still being used in 1991 for the cleaning of component groups. The second BlmSchV, as…

SMART group news

Colin Lea, Bob Willis

The UK is a leader in the implementation of surface mount technology, and SMARTEX '91 sponsored by the SMART Group is one of only a few shows organised worldwide which is…

International association news

The British Association for Brazing and Soldering (BABS) will be holding its 1992 Autumn Conference ‘The Joining Environment’ on 14–15 October 1992 at the Forte Posthouse Hotel…

Industry news

Alpha Metals has announced the appointment of Stan Renals to the position of General Manager, Alpha Singapore.

New Products

Alpha Metals has launched a range of thermoplastic die attach adhesives and adhesive films, following an agreement made with the manufacturers, Staystik Inc. The new adhesives…