Table of contents
Anisotropic Conducting Adhesives for Electronic Interconnection
D.J. Williams, D.C. Whalley, O.A. Boyle, A.O. OgunjimiThis paper presents analytical and computational models of adhesive joints constructed from anisotropic conducting materials. Such materials are becoming increasingly important in…
Facilitating Process and Material Changes in Production Soldering with Nitrogen
S.M. AdamsThe use of nitrogen‐based soldering environments, rather than ambient air, has been widely promoted for both reflow and machine soldering. Earlier claims of process improvements…
Solder Mask Strategies for Surface Mount Assembly
M.A. Paczkowski, S.T. ReddyOver the past few years there has been increasing utilisation of higher density surface mounting on printed wiring boards. As components and pads decrease in size, the topography…
A Heuristic Approach to Placement Sequence Identification for SMT
W. Shin, K. Srihari, J. Adriance, G. WestbySurface mount technology (SMT) is being increasingly used in printed circuit board (PCB) assembly. The reduced lead pitch of surface mount components coupled with their increased…
Solderability Changes of Printed Wiring Board Surfaces during Electronic Assembly Operations
H.E. Evans, J.P. Partridge, A.G. Miller, M.W. JacksonToday's electronic assembly manufacturing operations can be complex combinations of process steps such as IR reflow, wave soldering, special soldering of connectors or sensitive…
Industrial Qualification of a No‐clean Solder Cream
A. Mantrant‐Le BotNo‐clean is an attractive alternative for eliminating CFC consumption. For high complexity and reliability boards, a very low residue solder cream, free of halides, should be…
The Search for Lead‐free Solders
W.B. HampshireThe growing concern over the possibility of lead elimination from electronics solders has prompted the initiation of several studies by various groups. The same basic approach is…
SM Placement Technology: Part 1
H. PawlischekThis paper, which will be published in two parts in consecutive issues of Soldering & Surface Mount Technology, reproduces a chapter of the recently published book ‘Handbook of…
SMART news
The SMART Group entered a team for the Electronics Weekly 5‐a‐side competition at the Arsenal F.C. in January. Each team could have up to ten players, with substitutions…
International association news
The Surface Mount Equipment Manufacturers Association (SMEMA) has announced that its new document is ready for release. ‘Reflow Soldering Terms and Definitions Glossary’ was…
Environmental issues
Companies in the electronics and engineering sectors need to change from CFC and methyl chloroform based solvents now because these solvents will shortly be banned in Europe. For…
Industry news
Rob Knowles has been appointed Technical Service Specialist by Metech‐Ronal to support the company's rapidly expanding Thick Film Materials business throughout Europe.
New Products
The Surfair 500 Convection Reflow System has recently been launched by Surf Systems. Thermal engineering research over a 15‐month period has been carried out to develop an…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang