Table of contents
People, Machines and Material
TOM BORKESMost of us seem to be in a perpetual struggle to succeed (or, at worst, just survive) in our chosen careers, while simultaneously trying to prepare for the daunting challenges of…
Solderability Standard: A Gold Plated Nickel Reference Material
C. Hunt, D. WallisA gold plated nickel solderability reference material has been developed. The as‐plated material has very good solderability, which can be degraded in a controlled manner by heat…
Modelling of Solder Joint Geometry for Quality and Reliability
D.C. Whalley, P.P. Conway, F. Sarvar, D.J. WilliamsThe final geometry of the solder joints in surface mount technology (SMT) assemblies is dependant upon the design rules, the materials and the manufacturing processes used. An…
Reliability of Electronics in Harsh Environments
B. Brox, P.‐E. TegehallThis paper reports experiences gained in several research programmes, showing the necessity to develop improved environmental tests that better accelerate the mechanisms that…
Stencil Cleaning: An Area of Increasing Importance
F. Cala, R. ReynoldsStencil cleaning has become both more difficult and more critical for modern surface mount technology. There is an increasing need for cleaning agents for stencils which are…
Alloy 42 — A Material to be Avoided for Surface Mount Component Leads and Lead Frames
W. Engelmaier, B. FuentesAlloy 42 and, similarly, Kovar were developed to provide metallic feed‐throughs from the interior of ceramic components to the exterior. The low coefficient of thermal expansion…
High Quality Solder Pastes:: Printing and Soldering in the World of Fine Pitch
A.Z. MiricAs electronic devices have become more complex and interconnection density has increased, electronics manufacturers are facing new challenges to solder SMD packages with pitches…
The Impact of Soldering Temperatures on No‐clean Hand Soldering Processes
E.M. OhPCB manufacturers are switching from the use of RMA fluxes in their soldering and rework processes to low residue type (i.e., ‘no‐clean’) fluxes. Unfortunately, successful…
Voiding in BGAs
W.B. O'Hara, N.‐C. LeeVoiding in BGA assembly using SN63 solder bumps is primarily introduced at board‐level assembly stage. On the pretinned PCBs, voiding of BGA joints increases with increasing…
SMART news
With spaces at a premium at the SMART Group symposium in Newport, Gwent, on 5 June it is anticipated that a new ‘SMART Group Wales & West’ division may be formed to service the…
International association news
Date: 26 October 1995 Venue: The National Motorcycle Museum, Solihull, West Midlands The above Conference will consist of Soldering and Brazing sessions which will run in…
Industry news
K. GriesfellerQuad Europe Ltd has announced the appointment of two Regional Sales Managers in the UK, Ashley Dakin and Ross Fraser who become responsible for sales of ‘Quadline’ in the South…
New Products
Solder preforms from the Indium Corporation are now available in tape and reel for automatic pick and place equipment. Over 200 different alloys can be selected.
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang