Table of contents
Test chip and substrate design for flip chip microelectronic package thermal measurements
Teck Joo Goh, Chia‐Pin Chiu, K.N. Seetharamu, G.A. Quadir, Z.A. ZainalThis paper's purpose is to review the design of a flip chip thermal test vehicle.
A study of aluminium wire failure in automotive under‐hood applications
Sung Yi, Sang Kyoo Park, Kiat Choon TeoTo provide a design guideline for an automotive electronic module in order to improve its reliability in elevated environmental environments as well as in vibration environments.
Temperature dependence of silicon power MOSFETs switching parameters
R. Habchi, C. Salame, B. Nsouli, P. MialheThis paper presents measurements of device switching parameters performed on a commercial power MOSFET under high temperature conditions, along with the inverse and direct…
Voltage mode multifunction OTA‐C biquad filter
K. Kumar, K. PalTo develop an OTA‐C‐based universal filter realizing all standard transfer functions viz low pass, high pass, band pass, notch and all pass without an inverting amplifier and with…
Low voltage CCII‐based high performance cascadable multifunctional filter
T. Parveen, S.S. Rajput, M.T. AhmadAims to present a new low voltage CCII‐based high frequency performance voltage mode multifunctional filter, which can realize standard biquadratic low pass, band pass and high…
Uprating of electronic parts to address obsolescence
Michael Pecht, Dave HumphreyThe paper presents an alternative solution to address part obsolescence. This paper discusses approaches to solve part obsolescence including an uprating approach. This paper also…
Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life
K.O. Lee, K.E. Ong, K.N. Seetharamu, I.A. Azid, G.A. Quadir, T.J. GohAims to present a finite element analysis based methodology for estimating the characteristic fatigue life of a solder joint interconnect under accelerated temperature cycling to…
Impact of environmental regulations on green electronics manufacture
Richard Ciocci, Michael PechtThe purpose of this paper is to investigate the electronic industry's reaction to environmental regulations specifically in terms of lead‐free solders and halogen‐free…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson