Table of contents
Comparison approach on strain behavior of PBGA assembly by considering different thermal‐mechanical compound loading modes
Guangbin Tan, Ping Yang, Tianbo Li, Tao Xi, Xiaoming Yuan, Jianming YangThe purpose of this paper is to provide a systematic method to perform analysis and test for vibration‐thermal strain behavior of plastic ball grid array (PBGA) assembly by…
Power management of a wireless sensor node with solar energy harvesting technology
Kah‐Yoong Chan, Hee‐Joe Phoon, Chee‐Pun Ooi, Wai‐Leong Pang, Sew‐Kin WongPower management of a wireless sensor node is important and needs to be designed efficiently without wasting excessive energy. The purpose of this paper is to report on the…
Characterization and modelling of miniature ferrite transformer for high frequency applications
Mirjana S. Damnjanović, Ljiljana D. Živanov, Snezana M. Djurić, Andrea M. Marić, Aleksandar B. Menićanin, Goran J. Radosavljević, Nelu V. BlažSignificant achievements in ferrite material processing enable developments of many ferrite devices with a wide range of power levels and working frequencies, which make demands…
An 11 GHz low‐phase‐noise voltage‐controlled oscillator
Mei‐Ling Yeh, Yao‐Chian Lin, Wei‐Chieh ChangThe purpose of this paper is to design a low phase noise and high figure of merit, fully integrated, voltage‐controlled oscillator (VCO) which was fabricated in TSMC CMOS 0.18‐μm…
Fabrication of porous ZnO thin films using wet chemical etching with 0.5% HNO3
Ang Chai Im, Leonard Lu Tze Jian, Ooi Poh Kok, Suriani Yaakob, Ching Chin Guan, Ng Sha Shiong, Zainuriah Hassan, Haslan Abu Hassan, Mat Johar AbdullahThe purpose of this paper is to synthesize porous zinc oxide (ZnO) by means of strain etching/wet chemical etching method with the use of 0.5% of nitric acid (HNO3) etchant. The…
Optimal placement of modules on partially reconfigurable device for reconfiguration time improvement
Bouraoui Ouni, Abdellatif MtibaaThe purpose of this paper is to reduce the reconfiguration time of a field‐programmable gate array (FPGA).
The bulk alloy microstructure and tensile properties of Sn‐1Ag‐0.5Cu‐xAl lead‐free solder alloys (x=0, 1, 1.5 and 2 wt.%)
Dhafer Abdul‐Ameer Shnawah, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Fa Xing CheThe purpose of this paper is to investigate the effect of Al addition on the bulk alloy microstructure and tensile properties of the low Ag‐content Sn‐1Ag‐0.5Cu (SAC105) solder…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson