Table of contents
Analysis of packaging and sealing techniques for microelectronic modules and recent advances
P.K. Khanna, S.K. Bhatnagar, W. GustA critical analysis of packaging and sealing methods for integrated circuits, hybrid microcircuits and multichip modules has been done. The best hermetic and high yield weld seal…
Low cost prototyping of multichip modules ‐ the European INCO‐Copernicus project
Zsolt Illyefalvi‐Vitéz, Alfons Vervaet, André Van Calster, Nihal Sinnadurai, Marko Hrovat, Paul Svasta, Endre Tóth, Darko Belavic, Radu Mihai Ionescu, William DennehyThe opportunity for mutual benefit across Europe to develop low‐cost MCM technologies arose from recognition of the scientific skills and design and prototyping capabilities in…
Erratum
This article has been withdrawn as it was published elsewhere and accidentally duplicated. The original article can be seen here: 10.1108/02602289710172337. When citing the…
Effect of heat‐spreader sizes on the thermal performance of large cavity‐down plastic ball grid array packages ‐ NuCSP
John Lau, Tony ChenThe effect of heat‐spreader sizes on the temperature distribution, thermal resistance, and cooling power of a set of cost‐effective cavity‐down plastic ball grid array (PBGA…
Pros and cons of thermoplastic and thermoset polymer adhesives in microelectronic assembly applications
Ken Gilleo, Peter OngleyReviews the traditional use of thermoset (epoxy) adhesives for various bonding applications and highlights some limitations in today’s microelectronics arena. In particular…
Towards a better understanding of underfill encapsulation for flip chip technology: proposed developments for the future
Ken Gilleo, Matthew Witt, David Blumel, Peter OngleyMost flip chip assemblies require underfill to bestow reliability that would otherwise be ravished by stress due to thermomechanical mismatch between die and substrate. While…
Erratum
This article has been withdrawn as it was published elsewhere and accidentally duplicated. The original article can be seen here: 10.1108/01445159710163481. When citing the…
Interconnect solutions for advanced area array packaging
M.W. Hendriksen, F.K. Frimpong, N.N. EkereCSP (chip scale packaging) and flip chip area array technologies are emerging within the electronics packaging industry to provide solutions capable of fulfilling the…
Low cost high‐density multilayer circuits for MCM‐C
I. Born, D. Detemmerman, M. Vrana, J. De Baets, A. Van CalsterFor many years C‐MAC has used thick film technology in many electronic products for a large range of customer applications. A high degree of integration has been achievable…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson