Table of contents
A direct‐writing approach to the micro‐patterning of copper onto polyimide
J.H.‐G. Ng, M.P.Y. Desmulliez, M. Lamponi, B.G. Moffat, A. McCarthy, H. Suyal, A.C. Walker, K.A. Prior, D.P. HandThe purpose of this paper is to present a novel manufacturing process that aims to pattern metal tracks onto polyimide at atmospheric pressure and ambient environment. The process…
Cracking phenomena on flexible‐rigid interfaces in PCBs under thermo cycling loading
Luciano Arruda, Renato Bonadiman, Josineto Costa, Tommi ReinikainenThe purpose of this paper is to develop simulation models for flexible‐printed circuit boards' flex‐rigid interfaces and to perform experimental tests in the laboratory in order…
A multilayer process for the connection of fine‐pitch‐devices on molded interconnect devices (MIDs)
Thomas Leneke, Soeren Hirsch, Bertram SchmidtThe purpose of this paper is to present a new multilayer process for three‐dimensional molded interconnect devices (3D‐MIDs) that allows the assembly of modern area array packaged…
Low‐power noise multilayer PCB with discrete decoupling capacitors inside
Ki‐Jae Song, Jongmin Kim, Jongwoon Yoo, Wansoo Nah, Jaeil Lee, Hyunseop SimThe purpose of this paper is to present the power noise characteristics of a multilayer printed circuit board (PCB) in which discrete capacitors have been embedded.
Reflow ageing influences and wettability effects of immersion tin final finishes with lead‐free solder
Thomas Hetschel, Klaus‐Jürgen Wolter, Fritz PhillippThe purpose of this paper is to investigate the oxidation behaviour of an immersion tin final finish after multiple reflow ageing under air and nitrogen atmospheres and to study…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari