Table of contents
Microstructural characterisation of reflowed and isothermally‐aged Cu and Ag particulate reinforced Sn‐3.5Ag composite solders
F. Guo, S. Choi, J.P. Lucas, K.N. SubramanianComposite solders were prepared by mechanically dispersing 15v% of Cu or Ag particles into the eutectic Sn‐3.5Ag solder. The average sizes for the nominally spherical Cu and Ag…
The solvent of choice
Tim Lawrence, Ian Wilding, Balvinder ChowdharyThis paper outlines the current position of water based no‐clean liquid fluxes for wave soldering. The primary differences between these and “traditional” alcohol based liquid…
The effects of bump height on the reliability of ACF in flip‐chip
C.M.L. Wu, Johan Liu, N.H. YeungIn this study, flip‐chip (FC) assemblies on printed circuit board (PCB) and flex, with bump heights of 4, 20 and 40μm, and with a constant copper pad height were compared by…
Erratum
This article has been withdrawn as it was published elsewhere and accidentally duplicated. The original article can be seen here: 10.1108/EUM0000000005306. When citing the…
Tin pest in lead‐free solders
Yoshiharu Kariya, Colin Gagg, William J. PlumbridgeConsiders the effect of low temperatures on the characteristics of lead‐free alloys based upon tin, which is the most popular basis for the new alloys.
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang