Table of contents
Modelling the effect of voids in anisotropic conductive adhesive joints
K.K. Lee, N.H. Yeung, Y.C. ChanAnisotropic conductive adhesive film (ACF) is used for very fine pitch applications in the microelectronics industry, such as flip chip (FC) technology. During the bonding…
The effect of PCB surface finish on lead‐free solder joints
Sami T. Nurmi, Janne J. Sundelin, Eero O. Ristolainen, Toivo K. LepistöTo study the behaviour of voids in PBGA solder joints and their influence on the lifetime of lead‐free solder joints.
Sub process challenges in ultra fine pitch stencil printing of type‐6 and type‐7 Pb‐free solder pastes for flip chip assembly applications
G.J. Jackson, M.W. Hendriksen, R.W. Kay, M. Desmulliez, R.K. Durairaj, N.N. EkereThe study investigates the sub process behaviour in stencil printing of type‐6 and type‐7 particle size distribution (PSD) Pb‐free solder pastes to assess their printing limits.
Microstructural features contributing to enhanced behaviour of Sn‐Ag based solder joints
J.G. Lee, K.N. SubramanianTo determine the role of microstructure in the creep and thermomechanical fatigue (TMF) properties of solder joints made with eutectic Sn‐Ag solder, and Sn‐Ag solder with Cu…
Improving the reliability of a plastic IC package in the reflow soldering process by DOE
Geun Woo Kim, Kang Yong LeeOptimisation of the package design in order to reduce stresses in a plastic small outline J‐lead (SOJ) package and to thereby prevent fractures during the infrared soldering…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang