Table of contents - Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging
Guest Editors: Christopher Bailey, Johan Liu
Coffin‐Manson constant determination for a Sn‐8Zn‐3Bi lead‐free solder joint
Peng Sun, Cristina Andersson, Xicheng Wei, Zhaonian Cheng, Dongkai Shangguan, Johan LiuTo determine the Coffin‐Manson (CM) equation constants for fatigue life estimation of Sn‐8Zn‐3Bi solder joints, since Sn‐8Zn‐3Bi solder has a melting temperature of around 199°C…
High strain rate testing of solder interconnections
K.T. Tsai, F‐L. Liu, E.H. Wong, R. RajooThis paper aims to present a new micro‐impact tester developed for characterizing the impact properties of solder joints and micro‐structures at high‐strain rates, for the…
Intermetallic compound formation and diffusion path evolution in eutectic tin‐lead flip chip solder bumps after aging
Li‐Yin Hsiao, Jenq‐Gong DuhIn the flip‐chip technology (FCT) used in current microelectronic packages, a Ni‐based under‐bump metallurgy (UBM) is widely used due to its slow reaction rate with Sn. In this…
Macro‐micro modelling of moisture induced stresses in an ACF flip chip assembly
C.Y. Yin, H. Lu, C. Bailey, Y.C. ChanThis paper discusses the use of modelling techniques to predict the reliability of an anisotropic conductive film (ACF) flip chip in a humid environment. The purpose of this…
High performance anisotropic conductive adhesives for lead‐free interconnects
Yi Li, C.P. WongTo study the interface properties of anisotropic conductive adhesives (ACAs) and improve the electrical properties of ACA joints as a replacement for Sn/Pb solder in the…
Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy‐based binder
Masahiro Inoue, Katsuaki SuganumaThis paper investigates the variations in electrical properties of a typical isotropic conductive adhesive (ICA) made with an epoxy‐based binder that are caused by differences in…
Finite element analysis of fleXBGA reliability
Gang Chen, Xu ChenTo provide an approach to fleXBGA design and reliability analysis.
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang