Table of contents
Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective
Kati Kokko, Hanna Harjunpää, Anna‐Maija Haltia, Pekka Heino, Minna KellomäkiThe purpose of this paper is to study epoxy and parylene C‐coated samples. These coatings are used to protect the electronic devices from harsh environments. The effect of these…
Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints
Martin Wickham, Ling Zou, Christopher HuntAs the transition away from lead‐containing solders gathers momentum, isotropic conducting adhesives (ICAs) are being considered as possible replacements for conventional SnPb…
Improving high‐temperature oxidation behaviour of Sn‐Zn‐Ag‐Al‐Ga solders
T.K. Yeh, K.L. Lin, B. SalamThe purpose of this paper is to study the influence of silver on the high‐temperature oxidation behaviour of the Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga (x=0, 0.1, 0.3 and 0.5) solder alloys.
On the factors affecting the dissolution of copper in molten lead‐free solders and development of a method to assess the soldering parameters
D. Di Maio, C.P. HuntThe purpose of this paper is to investigate the various factors that influence the dissolution of copper in molten solder, paying particular attention to important parameters…
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints
Jianbiao Pan, Tzu‐Chien Chou, Jasbir Bath, Dennis Willie, Brian J. TolenoThe purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for…
Reflow profile optimization of μBGA solder joints considering reflow temperature and time coupling
Tao Bo, Yin Zhouping, Ding Han, Wu YipingThe purpose of this paper is to present a novel reflow profile optimization method using mechanical reliability estimation of micro‐ball grid array (μBGA) solder joints, based on…
Local melt process of solder bumping by induction heating reflow
Hongbo Xu, Mingyu Li, Yonggao Fu, Ling Wang, Jongmyung KimThe purpose of this paper is to describe a local melt process of solder bumping employed in electronic packaging applications by an induction heating reflow method, for a combined…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang