Table of contents
ACF curing process optimization based on degree of cure considering contact resistance degradation of joints
Bo Tao, Zhouping Yin, Youlun XiongFrom the viewpoint of degree of cure, the purpose of this paper is to find how to improve the reliability of flip‐chip packaging modules based on an anisotropically conductive…
Investigation of Sn‐Zn‐Bi solders – Part II: wetting measurements on Sn‐Zn7Bi solders on copper and on PCBs with lead‐free finishes by means of the wetting balance method
K. Bukat, J. Sitek, M. Kościelski, Z. Moser, W. Gąsior, J. PstruśThe purpose of this paper is to investigate the influence of Bi additions on the wetting properties of SnZn7Bi alloys (Bi=1 and 3 per cent by mass) on a copper substrate and…
Effects of multiple BGA rework on strength of solder joints
N. Dariavach, J. Liang, G. Barr, D. ShangguanThe purpose of this paper is to investigate effects of the multiple rework of ball grid array (BGA) components on mechanical strength of BGA balls, as well as any possible…
An experimental and numerical investigation into the effects of the chip‐on‐film (COF) processing parameters on the Au‐Sn bonding temperature
De‐Shin Liu, Shu‐Shen Yeh, Chun‐Teh Kao, Pay‐Yau Huang, Chia‐I Tsai, An‐Hong Liu, Shu‐Ching HoThe reliability of chip‐on‐film (COF) packages is fundamentally dependent upon the quality of the eutectic Au‐Sn joint formed between the Au bumps on the integrated circuit (IC…
Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance
S. Mallik, M. Schmidt, R. Bauer, N.N. EkereThe purpose of this paper is to study the rheological behaviours of lead‐free solder pastes used for flip‐chip assembly applications and to correlate rheological behaviours with…
Creep properties of Sn‐0.7Cu composite solder joints reinforced with nano‐sized Ag particles
Feng Tai, Fu Guo, Jianping Liu, Zhidong Xia, Yaowu Shi, Yongping Lei, Xiaoyan LiThe purpose of this paper is to investigate the creep properties of Sn‐0.7Cu composite solder joints reinforced with optimal nano‐sized Ag particles in order to improve the creep…
Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments
Guang Zeng, Songbai Xue, Liang Zhang, Zhong Sheng, Lili GaoThe purpose of this paper is to numerically evaluate the reliability of SnAgCuCe solder joints compared with that of SnAgCu. A trace amount of the rare earth (RE) element Ce was…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang