Soldering & Surface Mount Technology: Volume 27 Issue 3

Influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) technology

Janusz Sitek, Wojciech Stęplewski, Kamil Janeczek, Marek Kościelski, Krzysztof Lipiec, Piotr Ciszewski, Tomasz Krzaczek

The purpose of this paper is to evaluate the influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) Technology and demonstrate factors…

Materials and soldering challenges in lead-free Package-on-Package (PoP) technology

Marek Kościelski, Janusz Sitek, Wojciech Stęplewski, Grazyna Kozioł, Piotr Ciszewski, Tomasz Krzaczek

– The purpose of this paper is to present challenges met during package-on-package (PoP) technology implementation in real surface-mount technology assembly processes.

Investigation of treated PEN foil surface properties for inkjet application

Aneta Araźna, Konrad Futera, Małgorzata Jakubowska, Łucja Dybowska-Sarapuk

– The purpose of this paper is to report surface properties of treated Teonex Du Pont polyethylene naphthalate (PEN) foil substrates.

Inkjet printed microwave circuits on flexible substrates using heterophase graphene based inks

Konrad Futera, Konrad Kielbasinski, Anna Młozniak, Malgorzata Jakubowska

The purpose of this paper is to present the result of research on a new fabrication technology of printed circuits board and electronics modules. The new method is based on inkjet…

Noise sources in polymer thick-film resistors

Adam Witold Stadler, Andrzej Kolek, Krzysztof Mleczko, Zbigniew Zawiślak, Andrzej Dziedzic, Wojciech Stęplewski

The paper aims to get the knowledge about electrical properties, including noise, of modern polymer thick-film resistors (TFRs) in a wide range of temperature values, i.e. from 77…

Influence of thermal cycling on reliability of solder joints executed on long and metal core PCBs

Janusz Sitek, Aneta Araźna, Kamil Janeczek, Wojciech Stęplewski, Krzysztof Lipiec, Konrad Futera, Piotr Ciszewski

– The purpose of this paper is to evaluate the reliability of solder joints made on long FR-4 and metal core printed circuit boards using the accelerated thermal cycling.

High temperature thermogenerators made on DBC substrate using vapour phase soldering

Agata Skwarek, Beata Synkiewicz, Jan Kulawik, Piotr Guzdek, Krzysztof Witek, Jacek Tarasiuk

The purpose of this paper is to assess the reliability of thermoelectric generators after ageing at elevated temperature and to determine the influence of the technology used…

IMAPS-CPMT 2014 Poland

Agata Skwarek