Table of contents
A view from‘down under’
DIANNE HUNTSome of you may be surprised to learn of some of the inventions originating from Australian endeavours — the black box flight recorder, atomic absorption spectrophotometer…
The Influence of Flux Residues on the Quality of Electronic Assemblies
Kh.G. Schmitt‐Thomas, C. SchmidtIonic contaminations, especially flux residues due to manufacturing, cause various faults and failures of printed circuits during service. The contamination (µg‐eq NaCI), surface…
Observed Phenomenology of the Interaction between Solder Paste and Soldering Processes
M.R. Kalantary, F. Sarvar, P.P. Conway, D.J. Williams, D.C. WhalleyIncreases in component packing density and the consequent decrease in feature size in electronics products continue to place ever more emphasis on process design to manage or…
Development of a Novel No‐clean Low Residue Solder Paste for Fine Pitch Applications
A. BeikmohamadiAn experiment was conducted to examine the effect of post‐reflow no‐clean solder paste residue on near‐end and far‐end signal crosstalk due to changes in dielectric constant and…
Soldered Joint Reliability for Interstitial Pin Grid Array Packages
J. SeyyediThe reliability of solder joints and plated‐through‐hole (PTH) copper structure was investigated for 503 I/O interstitial pin grid array packages with two different pin diameters…
Effects of Voids and Their Interactions on SMT Solder Joint Reliability
S. Liu, Y.H. MeiSeveral finite element models were proposed to investigate the effects of voids and their interactions on SMT solder joint reliability in thermal mismatch loading. Both linear…
Hot‐bar Soldering of TAB Components with 0.150 mm OLB Pitch
A. MödlTape automated bonding (TAB) is a powerful technique for connecting fine‐pitch integrated components to the corresponding substrates. This paper describes the specific example of…
Cell Controller Software Modelling for PCBA Rework Cell
C.Y. Chan, A.H. Redford, N.N. EkereRework is an integral part of printed circuit board assembly (PCBA) manufacturing. However, the state‐of‐the‐art for PCBA rework still relies on operator activity and is therefore…
The Genesis of a Programmable Controller
A. FinckOver the past twenty years the programmable controller has been developed from a relatively simple hard‐ wired device used for controlling sequential operations to being almost a…
SMART group news
Rory DoyleThe SMART Group has been investigating joining methods for ball grid arrays (BGAs). Originally a development of IBM, and expected to be a dominant packaging technology, the BGA is…
International association news
Date: 26 October 1994 Venue: The Regency Hotel, Shirley, Solihull, West Midlands This conference will highlight technological advances being made as we approach the 21st century…
New Products
The EcowavePlus is a high performance wavesoldering system designed by Electrovert to optimise the no‐clean soldering process and to be environmentally friendly. The ‘green’…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang