Table of contents
Thick/thin film thermocouples as power source for autonomous microsystems – preliminary results
P. Markowski, A. Dziedzic, E. ProciowPossible application of mixed (thick/thin film) thermopiles to supply autonomous microsystems.
A 3D miniaturised programmable transceiver
Brendan O'Flynn, S. Bellis, K. Mahmood, M. Morris, G. Duffy, K. Delaney, C. O'MathunaTo describe the development of a three dimensional programmable transceiver system of modular design for use as a development tool for a variety of wireless sensor node…
Properties of PZT thick films made on LTCC
L.J. Golonka, M. Buczek, M. Hrovat, D. Belavič, A. Dziedzic, H. Roguszczak, T. ZawadaTo find properties of screen printed PZT (PbZr0.53Ti0.47O3 with 6 per cent of PbO and 2 per cent of Pb5Ge3O11) thick films layers on LTCC substrate.
Chip packaging challenges … a roadmap based overview
Andy LongfordTo provide an insight and view of the expected directions for microelectronic packaging, at chip level, that ties in current developments to the needs envisaged by emerging…
Reliability assessment for SnPb solder and Ag‐Pd bond pad metallization
Kiat Choon Teo, Yu Lin TingTo predict the reliability life for SnPb solder and Ag‐Pd bond pad metallization. The aim of selected artificial aging using temperature shock test (TST) and high temperature…
Delamination and solder flow‐out in underfilled and Pb‐free flip chips on laminate
Marc van Kleef, Jeroen Bielen, Jan Gülpen, Mike RamosIn land grid array hybrid or system in package type products passive integration on silicon dies are flip chip mounted on a laminate substrate using Pb‐free solder. To increase…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson